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Plasma Stripping Systems

YES-CV200RF & YES-CV200RFS

YES-CV200RF Specs (automated)
YES-CV200RFS Specs (manual)

Applications:

• Photoresist removal
• Polyimide removal
• Organics removal
• Etching
• Surface preparation
• CD master cleaning
• Descumming

YES-CV200 systems remove thick layers of photoresist or polyimide in the shortest amount of production time. Powerful plasma stripping "sandblasts" tough resist in an automated, user-friendly system. Or, for gentler cleaning operations, the "descum" function can be selected.

Touch screen control and real time pictorial readout of system status and maintenance requirements are standard. Process data is output to a recording computer and compiled into a Microsoft® Excel report.

Benefits:

• Environmentally friendly - no wet chemical usage
• Higher yields
• Repeatable results
• Strip rates up to 6,000 - 7,000 Angstroms per minute
• Zero CV shift

System Features

Low Frequency
YES systems use capacitive plasma generation with a relatively low plasma generation frequency, 40kHz. This reduces parasitic capacitive reactance losses for more efficient plasma generation. The result is reduced chamber and product heating that can be caused by high (13.56 MHz) frequency systems.

Variable Power Supply
YES systems allow viariable plasma power settings for flexibility--from 150 watts to 1250 watts. This flexibility enables a wide range of applications, from aggressive strip processes to gentle cleaning and surface modification applications.

Downstream Process
Plasma must pass through a grounded, perforated plate to reach substrates. This grounded plate serves to balance the charge in the plasma and shield your product from damaging UV exposure. For sensitive CMOS devices, low plasma charge paired with less UV exposure significantly reduces plasma damage that may induce a CV shift. The CV shift is essentially zero.

Temperature Control
YES plasma strip/descum systems offer precise temperature control to achieve uniform, repeatable results.

Multiple Process Gas Inputs
YES plasma strip/descum systems come standard with four process gas connections. Mass flow controllers (MFCs) are available as an option for mixing gasses.

Options:

• Mass flow controllers
• Automatic downstream pressure control
• Data collection and analysis software